Ball Attach and Recovery System

BM4500 Ball Attach System

  • High Productivity ≥ 200K balls one time mounting
  • Mounting accuracy ± 25 µm with 25MP CCD
  • Able to handle substrate and single IC ball mount
    (single unit with edge distance < 0.1mm)
  • Warped substrate control by press head at vacuum stage
    (max warpage up to 15mm)
  • Fur Bin box with stable productivity without missing ball from template. High first pass yield of 99.997%
  • Fast jig conversion time < 30 minutes
  • Integrable with inline Ball Recovery system
  • Capable to do Pillar Mount
Items Specification

Target BGA Substrate
a) Strip type capable size
b) Singulated type capable size

L x W, mm
180 x 50mm -> 300 x 100mm, Minimum thickness 0.1mm
10 x 10 mm — 80 x 80mm, Minimum thickness 0.1mm, Boat size (max) 160 x 310mm

Flux Printing Process
a) Fluxing Method
b) Positioning Accuracy


Printing
< ± 25 µm

Ball Mounting Process
a) Ball Mounting Method
b) Capable Ball Size / Pitch
c) Position Accuracy
d) Ball count per pick


Fur Bin Box + Inclined Template + Vacuum Pick & Place
Φ0.08 – φ0.89 mm / 0.125mm – 1.50mm
< ±10 μm (Mechanical Accuracy) ≥ 200,000

Post ball mount inspection

25MP CCD (missing ball, extra ball, ball offset, ball diameter)

Cycle Time

14-18 [sec/1time] / Strip; 18-25 [sec/1time] / Single Unit

Dimension

W x D x H 3400mm x 1350mm x 1780mm
back
Scroll to Top