KGD Die Level Test Handler
IGBT/SiC KGD Die Level Test Handler
- Die level testing capability
(□ 0.3mm – □ 20 mm, up to 3 test sites) - Room temperature to 200°C
(± 3°C) - Output to wafer ring or waffle tray
- High voltage and high current test capability
(up to 6KV, 3KA) - High contact accuracy
(± 10 ㎛, tilt <0.05°) - Option for AOI integration
- TCP-IP/GPIB/E84/SECS-GEM
| Items | Specification |
|---|---|
|
Applications |
IGBT/ SiC |
|
Input |
6/8/12” Wafer Ring |
|
Output |
6/8/12” Wafer Ring /2,4” Wafer Tray/Tape & Reel (Option)
|
|
Die Size |
0.3 x 0.3mm – 20 x 20mm |
|
Die Thickness |
>60 µm (Option: 20 µm) |
|
Accuracy for contact |
X,Y < ± 10 µm; tilt <0.05° |
|
Test Station |
2 stations support/3 stations (Option) |
|
UPH |
1200 units (Dry Run) |
|
Contact |
Micro Chuck / Probe Card |
|
Docking |
Hard dock |
|
Temperature |
Ambient to 200°C (± 3°C) |
|
Heating |
Pre-Heat Station |
|
|
N2 Heating Up to 200°C |
|
Communication |
TCP-IP/GPIB/E84/SECS-GEM |
|
Bins |
Wafer mapping / 10 hard bins (Stack Tray) |
|
Picker |
Nozzle Head Auto Conversion, with Force Control System, 0.5-5N |