Bonders
Merak FCB3000S Flip Chip Bonder
- High Productivity > 8K UPH (2 head module)
- High Bonding Accuracy XY ± 5 μm, θ ± 0.02° (Ball screw linear driven)
- Wide Range of Work Piece (8”/12” wafer, Substrate/Panel size up to 200 x 330mm)
- Minimized Change Over with One Touch Change Design (Up to 3 set)
- Auto Bond Head Tooling Change (Up to 10 set)
- Auto Ejector Module Change (Up to 3 set)
- Bond Head Over-Travel Protection (soft touch down)
- Modularized Collet Holder (Quick change and Flatness Assurance)
- High Flatness Work Stage with Auto Height Detection (20 µm )
- User friendly GUI, SMEMA, SECS/GEM, E84 (for OHT / AGV handling automation)
| Items | Specification |
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System Productivity |
> 8,000 UPH (Dry Run for Chip Size at 5x5mm)
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System Capability
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Bonding Accuracy X,Y ≤ ±5㎛ (3Sigma）/ θ:±0.02˚ (Face Up Bonding Accuracy up to ±10um less） |
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Material Handling Capability
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Die Size □ 0.4 ~ □ 25 mm (Option : ~ □35mm) Thickness 60 ~ 700㎛ (Option: 25-60um) / Si Etc
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Substrate Size Range: 50x50mm ~ 200mm (W) x 330mm (L) / Thickness 0.15 ~ 2.5mm / Passline 950mm / Strip Type and Single Type Capability
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Wafer System
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Wafer Handling 12” Wafer (Standard) 8” Wafer(Option) / Auto-Theta alignment ±5˚ / Auto Loading Unloading
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Bond Head Modules (2 Sets)
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Bonding Head (Y Axis Moving) x 2 Sets / 360 Degree Rotation / Bond Force 50 ~ 3000g ± 5% (Standard) （Option min bond force to 20gram) |
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Flux Dipping Modules (2 Sets) |
High Flatness Mirror Type Flux Dipping Cavity (Maximum C4 Size 35x35mm) / Flatness within ±5㎛ (Optional ±2㎛)
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Pattern Recognition System
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PR System 256 Grey levels / Resolution 2048 pixels x 2048 pixels / Position Accuracy ± ¼ pixel / Angular accuracy ± 0.1˚
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Flip Chip Units (2Sets)
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DD-Motor-Control Auto Flip Chip Module / Optional Face Up Function
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Tripod Ejector ATC System
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Patent Designed Tripod Ejector Auto Tooling Change System (Option Up to 3 Kinds)
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Bonding Head Tip ATC System |
Patent Designed Bonding Tips Auto Change System (Option with more than 10 Kinds depending on Chip Size)
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PRS / DOF System |
Substrate PRS System x 2 Sets / Wafer PRS System / DOF System x 2 Sets
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Facilities Required |
Voltage AC380 ±10% , 3 phase/ Compressed air Over 5 Kgf/㎠ / Vacuum -750 mmHg below / Power Consumption Approx. 6.2Kw
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Dimensions & Weight |
W x D x H 1800mmX1550mmX1650mm / Weight Approx 2,200kg / Paint KN-90
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