AOI
WB 3D AOI
WBI-3000S is a wire bond process defect inspection equipment with advantages such as automation, non-contact, fast speed, high precision, and high stability.
- Equipment function-
Missing wire, extra wires, broken wire, wire height, wire width, wrong wire, sagging wire, wire bent, solder joint offset, chip cracks, scratches, foreign objects, adhesive contamination, etc.
| Items | Specification |
|---|---|
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High Speed |
< 0.2sec/die（sample die size 6.1 x 5.7mm)
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Versatility |
Up to 5 layers of wiring defect detection |
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Precision |
±1.5um positional accuracy with marble platform
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Loading |
Support magazine/manual, and Inline/OHT/AGV
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Camera Resolution |
5 Mega Pixel ~ 65 Mega Pixel/Mono
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Minimum Defect Inspection
|
Minimum wire width 20um，minimum pitch 60um
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Inspection Accuracy |
Horizontal resolution 2.5-8.3um，Z resolution2-15um，repeated accuracy 0.2um-2um。
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Number of Wire layers
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Up to 5 layers
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